Lithographic method and device manufactured thereby
US7745095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2007 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jul 31, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2041
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate processing method of a substrate provided with an anti-reflective coating which extends to or beyond a peripheral edge of the substrate is disclosed. The method includes removing a portion of the anti-reflective coating adjacent to and around a periphery of the substrate using a back-side removal process, depositing a layer of radiation sensitive material onto the anti-reflective coating, depositing a top-coat layer onto the layer of radiation sensitive material, and simultaneously removing a portion of the layer of radiation sensitive material and a portion of the top-coat layer from around an area adjacent to the periphery of the substrate using a top-side removal process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.