Manufacturing method of semiconductor device
US7745258B2 · kind B2 · utility
2Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2008 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Nov 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of the semiconductor device including a step of forming solder balls on the circuit face of a mother chip, a step of making flip chip bonding of the daughter chip after the step of forming solder balls on the circuit face of the mother chip, and a step of making flip chip bonding of the mother chip on a circuit board using the solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.