Methods for packaging an image sensor and a packaged image sensor
US7745897B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2005 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Apr 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The transparent cover is then glued to the image sensor at the metallic bumps. Electrical connections are formed between the image sensor and the substrate using, for example, conventional wire bonding techniques. The electrical connections are encapsulated within an epoxy for protection. In an embodiment, multiple image sensors are packaged together on the same substrate and separated into individually packaged image sensors by, for example, sawing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.