Patent · US Active

Compliant integrated circuit package substrate

US7745917B2 · kind B2 · utility

0Cited by

2References

13Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Biju Chandran · Chandler, US
Mitul Modi · Phoenix, US

Key dates

Filing date	Feb 5, 2010
Grant date	Jun 29, 2010
Priority date	—
Expiry date	Feb 5, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit package may include a plurality of interconnects, and an integrated package substrate coupled to the plurality of interconnects and comprising an integrated circuit package substrate core. A first surface of the integrated circuit package substrate core may define a depression.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.