Method for producing connection member
US7748110B2 · kind B2 · utility
47Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Apr 29, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.