Patterned structure for a thermal interface
US7748440B2 · kind B2 · utility
11Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2005 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Apr 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.