Method and apparatus for semiconductor processing
US7748944B2 · kind B2 · utility
6Cited by
52References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Oct 30, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.