Technique for increasing the compliance of tin-indium solders
US7749336B2 · kind B2 · utility
2Cited by
25References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2006 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Feb 24, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C13/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.