Technique for increasing the compliance of lead-free solders containing silver
US7749340B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2006 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Mar 8, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3006
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.