Electroformed stencils for solar cell front side metallization
US7749883B2 · kind B2 · utility
41Cited by
7References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2008 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Aug 29, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for providing metallization upon a semiconductor substrate utilizing a stencil having at least one aperture extending from the contact side to the fill side, the contact side of the stencil being substantially flat and forming a sharp edge with a wall of the at least one aperture, the at least one aperture being tapered such that an area of a cross-section of the at least one aperture at the fill side is larger than an area of the cross-section of the at least one aperture at the contact side. A method of forming a stencil for depositing metallization lines on a semiconductor substrate is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.