Microlens and an image sensor including a microlens
US7750424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Aug 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8053
Abstract
A microlens, an image sensor including the microlens, a method of forming the microlens and a method of manufacturing the image sensor are provided. The microlens includes a polysilicon pattern, having a cylindrical shape, formed on a substrate, and a round-type shell portion enclosing the polysilicon pattern. The microlens may further include a filler material filling an interior of the shell portion, or a second shell portion covering the first shell portion. The method of forming a microlens includes forming a silicon pattern on a semiconductor substrate having a lower structure, forming a capping film on the semiconductor substrate over the silicon pattern, annealing the silicon pattern and the capping film altering the silicon pattern to a polysilicon pattern having a cylindrical shape and the capping film to a shell portion for a round-type microlens, and filling an interior of the shell portion with a lens material through an opening between the semiconductor substrate and an edge of the shell portion. The image sensor includes a microlens formed by a similar method and a photodiode having a cylindrical shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.