Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
US7750483B1 · kind B1 · utility
103Cited by
149References
130Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2006 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Jun 18, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and an enlarged plated contact terminal, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, the metal pillar is welded to the routing line and includes a ball bond and a stem, and the plated contact terminal is plated on the stem.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.