Metal-metal bonding of compliant interconnect
US7750487B2 · kind B2 · utility
35Cited by
26References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2004 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Aug 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.