Polishing head testing with movable pedestal
US7750657B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Aug 5, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/0053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be positioned using a positioner having a first plurality of test wafer engagement members positioned around the pedestal central wafer support surface. In another aspect, the wafer position may have a second plurality of test wafer engagement members positioned around an outer wafer support surface disposed around the pedestal central wafer support surface and adapted to support a test wafer. The second plurality of test wafer engagement members may be distributed about a second circumference of the ring member, the second circumference having a wider diameter than the first circumference. Additional embodiments and aspects are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.