Patent · US Active

Calibration of non-vibrating contact potential difference measurements to detect surface variations that are perpendicular to the direction of sensor motion

US7752000B2 · kind B2 · utility

6Cited by

64References

20Claims

0Family size

Assignee

Qcept Technologies, Inc. · US

Inventors

Mark Schulze · Austin, US
William R. Usry · Austin, US

Key dates

Filing date	May 2, 2008
Grant date	Jul 6, 2010
Priority date	—
Expiry date	Mar 4, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/14
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method and system for determining the contact potential difference of a wafer surface using a non-vibrating contact potential difference probe and a vibrating contact potential difference probe. The method and system involves scanning the wafer surface with a non-vibrating contact potential difference sensor, integrating and scaling the resulting data, and applying offsets to individual tracks of data to match the integrated scaled data to measurements made using a vibrating contact potential difference sensor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.