Method for manufacturing a surface and integrated circuit using variable shaped beam lithography
US7754401B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2009 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | May 27, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/143
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method is disclosed in which a plurality of variable shaped beam (VSB) shots is used to form a desired pattern on a surface. Shots within the plurality of shots are allowed to overlap each other. Dosages of the shots may also be allowed to vary. The union of the plurality of shots may deviate from the desired pattern. The plurality of shots may be determined such that a pattern on the surface calculated from the plurality of shots is within a predetermined tolerance of the desired pattern. In some embodiments, an optimization technique may be used to minimize shot count. In other embodiments, the plurality of shots may be optionally selected from one or more pre-computed VSB shots or groups of VSB shots. The method of the present disclosure may be used, for example, in the process of manufacturing an integrated circuit by optical lithography using a reticle, or in the process of manufacturing an integrated circuit using direct write.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.