Apparatus for forming film hole
US7754623B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 21, 2006 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Jul 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An exemplary film hole forming apparatus (400) includes a chemical etching system (410) and a driving system (420). The driving system includes a transmission belt, which passes through the chemical etching system. A material of the transmission belt is polytetrafluoroethylene, polytetrafluoroethylene-containing material, polyvinylidene fluoride, metal, or metal-sandwiched composite. An exemplary method for forming film holes includes the following steps: providing a flexible printed circuit board (300) to be etched, with copper holes (321) pre-formed thereat and the copper holes exposing a base film (310) at corresponding positions; and transporting the flexible printed circuit board into a chemical etching system by a transmission belt to form film holes in the base film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.