Hybrid integrated circuit device, and method for fabricating the same, and electronic device
US7755182B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2009 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Mar 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.