Transducer assembly for a bonding apparatus
US7757926B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2006 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | May 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/75
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.