Apparatus for spraying etchant solution onto preformed printed circuit board
US7758716B2 · kind B2 · utility
2Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2006 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Dec 25, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed pipes has a middle portion (402) and two end portions (401). The middle portions of the feed pipes are located on a first plane and the end portions of the feed pipes are located on a second plane parallel to the first plane. The number of nozzles are mounted on the middle portion and the two end portions of each feed pipe. The number of nozzles are in fluid communication with the feed pipes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.