Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module
US7759716B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2008 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Jun 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device in which a plurality of chips can be reliably stacked without reducing integration thereof. The semiconductor device includes a substrate on which a circuit is provided. Pads are disposed on the substrate for testing the circuit. At least one terminal is provided on the substrate. First conductors are used to electrically couple the pads and the circuit. Second conductors are used to electrically couple the at least one terminal and the circuit. A switching element is disposed in the middle of the first conductors to control the electrical connection between the pads and the circuit. A plurality of semiconductor devices may be stacked on top of one another to form a stacked module, wherein chip selection lines are formed, which extend to the bottom of each of the semiconductor devices to electrically couple chip selection terminals from among the at least one terminal of the semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.