Inventor · Seongnam-si, KR

Sun-Won Kang

42Patents
7h-index
47Co-inventors
69Inventor score

Filing activity: Jun 5, 1996 → Apr 24, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US7598607B2 Semiconductor packages with enhanced joint reliability and methods of fabricating the same Electricity 92 Active
US5669642A Outside door handle automatic locking device for automobiles Emerging Cross-Sectional Technologies 65 Expired
US8791580B2 Integrated circuit packages having redistribution structures Electricity 40 Active
US7129571B2 Semiconductor chip package having decoupling capacitor and manufacturing method thereof Emerging Cross-Sectional Technologies 32 Expired
US8153521B2 Wafer-level stack package Electricity 20 Active
US7508061B2 Three-dimensional semiconductor module having multi-sided ground block Electricity 10 Active
US7588964B2 Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same Electricity 10 Active
US7893526B2 Semiconductor package apparatus Electricity 7 Active
US7964948B2 Chip stack, chip stack package, and method of forming chip stack and chip stack package Electricity 6 Active
US8254140B2 Mounting substrate Electricity 5 Active
US7663903B2 Semiconductor memory device having improved voltage transmission path and driving method thereof Electricity 5 Active
US7884458B2 Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package Electricity 4 Active
US8519470B2 Semiconductor chip, and semiconductor package and system each including the semiconductor chip Electricity 4 Active
US9780049B2 Semiconductor package Electricity 4 Active
US9859263B2 Semiconductor package Electricity 3 Active
US8097940B2 Stack package Electricity 3 Active
US8143693B2 Semiconductor device including redistribution line structure and method of fabricating the same Electricity 3 Active
US7759716B2 Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module Electricity 3 Active
US7586182B2 Packaged semiconductor die and manufacturing method thereof Electricity 3 Active
US7924592B2 Semiconductor memory device having improved voltage transmission path and driving method thereof Electricity 2 Active
US7812445B2 Semiconductor memory module having an oblique memory chip Emerging Cross-Sectional Technologies 2 Active
US8039928B2 Chip stack package Electricity 2 Active
US10756062B2 Semiconductor chip and semiconductor package including the same Electricity 2 Active
US8115324B2 Semiconductor module Electricity 2 Active
US10141293B2 Semiconductor package Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.