Patent · US Active

Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules

US7759754B2 · kind B2 · utility

3Cited by

21References

19Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Ewald Karl Michael Günther · Regenstauf, DE
Jörg Erich Sorg · Regensburg, DE
Karl Weidner · Birkenfeld, DE
Jörg Zapf · Munich, DE

Key dates

Filing date	Oct 27, 2004
Grant date	Jul 20, 2010
Priority date	—
Expiry date	Jan 18, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24331
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.