3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules
US7759784B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2005 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Feb 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0278
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.