Patent · US Active

Method of forming probe card assembly

US7759952B2 · kind B2 · utility

4Cited by

15References

12Claims

0Family size

Assignee

TOUCHDOWN TECHNOLOGIES, INC. · US

Inventors

Raffi Garabedian · Monrovia, US
Nim Tea · Los Angeles, US
Steven Wang · Fremont, US
Heather Karklin · San Francisco, US

Key dates

Filing date	Sep 14, 2007
Grant date	Jul 20, 2010
Priority date	—
Expiry date	Nov 22, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53243
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.