Modified core for circuit module system and method
US7760513B2 · kind B2 · utility
7Cited by
272References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2006 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Feb 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. The populated flexible circuitry is disposed proximal to a rigid substrate to place the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The rigid substrate exhibits adhesion features that allow more advantageous use of thermoplastic adhesives with concomitant rework advantages and while providing flexibility in meeting dimensional specifications such as those promulgated by JEDEC, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.