Method for repairing a microelectromechanical system
US7761966B2 · kind B2 · utility
1Cited by
23References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2007 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Jul 16, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for repairing a damaged probe from a probe card comprising the steps of removing the damaged probe from the probe card, separating one a plurality of replacement probes from a substrate and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.