Bond head for heavy wire bonder
US7762449B2 · kind B2 · utility
6Cited by
24References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2008 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Feb 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding apparatus for bonding a length of wire comprises a first module which is drivable along a linear axis towards and away from a bonding point and a second module slidably mounted to the first module. A wire cutter is mounted to the first module and a bonding tool is mounted to the second module. A coupling mechanism is operative to lock the second module in fixed relative position to the first module, and to unlock the second module from its fixed relative position to the first module so that the second module is slidable relative to the first module in directions parallel to the linear axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.