Heating device
US7763831B2 · kind B2 · utility
4Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2007 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Jul 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/013
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heating device has a ceramic base with a heating surface, and a heating body embedded in the ceramic base. The heating device includes a thermal conductive member positioned between the heating surface and the heating body in the ceramic base. The thermal conductive member has a thermal conductivity that is higher than the ceramic base and as such, the heating device achieves superior temperature uniformity of a heated object particularly in a semiconductor device manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.