Heat slug for package structure
US7763959B2 · kind B2 · utility
2Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2007 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Aug 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat slug is provided for a package structure, including a main body and a plurality of protrusions. The main body has a surface in which at least one ditch is defined. Each protrusion is connected to and extends from the main body and has a surface in which a plurality of dimples is defined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.