Solution and process for improving the solderability of a metal surface
US7767009B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 14, 2005 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Feb 28, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.