Micro-fluid ejection assemblies
US7767103B2 · kind B2 · utility
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8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2004 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Jul 19, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1646
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.