Patent · US Active

Micro-fluid ejection assemblies

US7767103B2 · kind B2 · utility

0Cited by
8References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 14, 2004
Grant dateAug 3, 2010
Priority date
Expiry dateJul 19, 2027

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB41J2/1646
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.