Karthik Vaideeswaran
14Patents
4h-index
24Co-inventors
56Inventor score
Filing activity: Nov 4, 2003 → Jul 16, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8721823B2 | Method of forming large diameter thermoplastic seal | Emerging Cross-Sectional Technologies | 23 | Active |
| US7438392B2 | Microfluidic substrates having improved fluidic channels | Performing Operations; Transporting | 15 | Active |
| US7041226B2 | Methods for improving flow through fluidic channels | Performing Operations; Transporting | 12 | Expired |
| US9121507B2 | Springs and methods of forming same | Emerging Cross-Sectional Technologies | 9 | Active |
| US9702462B2 | Large diameter thermoplastic seal | Emerging Cross-Sectional Technologies | 3 | Active |
| US7271105B2 | Method for making a micro-fluid ejection device | Performing Operations; Transporting | 2 | Expired |
| US7938975B2 | Method for making a micro-fluid ejection device | Performing Operations; Transporting | 2 | Active |
| US6881677B1 | Method for making a micro-fluid ejection device | Performing Operations; Transporting | 2 | Expired |
| US7344994B2 | Multiple layer etch stop and etching method | Performing Operations; Transporting | 1 | Expired |
| US8603411B2 | Polymer material and seals formed thereof for high pressure pump applications | Physics | 1 | Active |
| US7423073B2 | Radiation curable compositions having improved flexibility | Physics | 1 | Expired |
| US7368396B2 | Dry etching methods | Electricity | 1 | Expired |
| US7767103B2 | Micro-fluid ejection assemblies | Performing Operations; Transporting | 0 | Active |
| US8349959B2 | Polymer material and seals formed thereof for high pressure pump applications | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.