Wafer support pin for preventing slip dislocation during annealing of water and wafer annealing method using the same
US7767596B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Dec 26, 2007 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Jun 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer support pin has a front end contacted with a wafer such that the front end is flat or rounded. Thus, gravitational stress is minimized during annealing the wafer, thereby minimizing slip dislocation. This wafer support pin is suitably used for annealing of a wafer, particularly high temperature rapid thermal annealing of a large-diameter wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.