Passive components in the back end of integrated circuits
US7768055B2 · kind B2 · utility
21Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2005 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Apr 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Passive components are formed in the back end by using the same deposition process and materials as in the rest of the back end. Resistors are formed by connecting in series individual structures on the nth, (n+1)th, etc levels of the back end. Capacitors are formed by constructing a set of vertical capacitor plates from a plurality of levels in the back end, the plates being formed by connecting electrodes on two or more levels of the back end by vertical connection members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.