Apparatus and methods for cooling semiconductor integrated circuit package structures
US7768121B2 · kind B2 · utility
10Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2007 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Jul 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.