Patent · US Active

Horizontal dual in-line memory modules

US7771206B2 · kind B2 · utility

2Cited by

9References

34Claims

0Family size

Assignee

Qimonda AG · DE

Inventors

Michael Bruennert · Munich, DE
Peter Gregorius · Munich, DE
Georg Braun · Hersbruck, DE
Andreas Gartner · Wien, AT
Hermann Ruckerbauer · Radolfzell, DE
George Alexander · Durham, US
Johannes Stecker · Birkenfeld, DE

Key dates

Filing date	Sep 11, 2008
Grant date	Aug 10, 2010
Priority date	—
Expiry date	Sep 11, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/049
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Horizontal dual in-line memory modules are disclosed. In one embodiment, the memory module includes a circuit board, a plurality of memory chips attached to a top surface of the circuit board, and a plurality of connector contacts disposed under a back surface of the circuit board and extending away from the memory chips, the connector contacts being electrically coupled to the memory chips, the back surface opposite the top surface of the circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.