Semiconductor manufacturing apparatus
US7771535B2 · kind B2 · utility
5Cited by
1References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 29, 2006 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Jan 24, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45578
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor manufacturing apparatus has a nozzle with a plurality of tiny holes. The nozzle is connected to a vacuum pump through a valve without closing its end so as to be evacuated and purged independently of the reaction chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.