Patent · US Active

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

US7772036B2 · kind B2 · utility

11Cited by

10References

9Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Robert Bauer · San Diego, US
Anton Kolbeck · Lindenberg im Allgäu, DE

Key dates

Filing date	Apr 6, 2006
Grant date	Aug 10, 2010
Priority date	—
Expiry date	Jul 5, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package (7) with an exposed pad or power die flag (70) having multiple integrated THT heat spreader pins (71) configured for insertion into one or more vias (77) formed in a printed circuit board (78). The through hole heat spreader pins (71) may be formed as an integral part of the exposed pad (52) or may be solidly connected with the exposed pad (62).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.