Procedure for arranging chips of a first substrate on a second substrate
US7772039B2 · kind B2 · utility
171Cited by
12References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2005 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Nov 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for arranging chips of a first substrate on a second substrate, in which the chips are grouped at least into first chips and into second chips, the first chips of the first substrate are singulated and the singulated first chips are arranged on the second substrate in such a way that each of the first chips on the second substrate is unambiguously assigned to the associated first chip on the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.