Wire bond method for angularly disposed conductive pads and a device made from the method
US7772045B1 · kind B1 · utility
2Cited by
12References
40Claims
0Family size
Inventor
Key dates
| Filing date | Oct 24, 2007 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Dec 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and device relating the electrical interconnection of angularly disposed conductive is disclosed. Conventional wire bonding equipment is used to apply a wire ball on a first conductive surface in an electronic assembly. A conductive wire is drawn up vertically and terminated such that the central portion of the wire is proximal the second conductive surface. The electronic assembly is reoriented with respect to the travel of the capillary whereby a stitch bond is defined upon the second conductive surface to define an interconnect wire and a terminal wire portion, which terminal wire portion is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.