Randy Bindrup
7Patents
2h-index
6Co-inventors
40Inventor score
Filing activity: Feb 18, 2004 → Aug 29, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7215854B2 | Low-loss optical waveguide crossovers using an out-of-plane waveguide | Physics | 4 | Expired |
| US8637985B2 | Anti-tamper wrapper interconnect method and a device | Electricity | 2 | Active |
| US7772045B1 | Wire bond method for angularly disposed conductive pads and a device made from the method | Electricity | 2 | Active |
| US7062130B2 | Low-loss optical waveguide crossovers using an out-of-plane waveguide | Physics | 1 | Expired |
| US9431275B2 | Wire bond through-via structure and method | Electricity | 1 | Active |
| US8609473B2 | Method for fabricating a neo-layer using stud bumped bare die | Electricity | 0 | Active |
| US9741680B1 | Wire bond through-via structure and method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.