Resin compositions, cured article obtained therefrom, and sheet
US7772295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2006 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Sep 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
To provide a resin composition excellent in conformability to special shapes and in holding power without the need of containing a low molecular softener such as a plasticizer, other than a polysiloxane, and a cured product and a sheet using it.A resin composition characterized by comprising (a) an acrylic rubber, (b) a compound containing at least two mercapto groups per molecule, (c) a compound containing at least two acryloyl and/or methacryloyl groups per molecule, (d) an acrylate and/or methacrylate having a C2-12 alkyl group, and (e) acrylic acid or methacrylic acid. The above resin composition which contains a thermally conductive filler. A cured product and sheet using it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.