Resin molding material
US7772317B2 · kind B2 · utility
1Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2006 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Feb 11, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a resin molding material having a remarkably excellent abrasion resistance while maintaining a favorable mechanical strength. The resin molding material is improved in deterioration of the abrasion resistance caused by an abrasive powder generated from an inorganic substance, particularly from a glass fiber or the like. The resin molding material contains a resin, a carbon substance and an inorganic substance. The carbon substance contains an adhesive carbon substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.