Substrate processing method and storage medium having program stored therein
US7774082B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2007 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Feb 3, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
First feedforward calculation is executed when a preprocessing surface profile is measured and a processing chamber with its processing parameter value having been obtained through the first feedforward calculation judged to be within an allowable range is determined. Wafer transfer is executed only in conjunction with a processing chamber having a processing parameter value judged to be within the allowable range, and the wafer is carried to the entry point of the processing chamber. Then, second feedforward calculation is executed by reflecting the results of feedback calculation executed based upon the most recent processing having been executed in the particular processing chamber and wafer processing is executed in the processing chamber based upon the processing parameter value calculated in the second feedforward calculation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.