Patent · US Active

Sensor component and method for producing a sensor component

US7775115B2 · kind B2 · utility

15Cited by

4References

35Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Horst Theuss · Wenzenbach, DE
Thomas Herndl · Biedermannsdorf, AT
Werner Weber · Munich, DE
Joachim Weitzel · Markt Indersdorf, DE
Albert Auburger · Regenstauf, DE

Key dates

Filing date	Mar 28, 2007
Grant date	Aug 17, 2010
Priority date	—
Expiry date	Nov 27, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A device for detecting a measured quantity has a sensor chip for detecting the measured quantity, a supply for providing a power supply, and an injection-molded enclosure for accommodating the sensor chip and the supply, the injection-molded enclosure including integrated conductive traces providing an electrical connection between the sensor chip and the supply.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.