Configurable polishing apparatus
US7775853B2 · kind B2 · utility
2Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2007 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Sep 7, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.