Acrylic adhesives for metal bonding applications
US7776963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2005 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Nov 26, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J4/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesive formulations having acrylate monomer or methacrylate monomer, or mixtures thereof, and having a reducing agent and an initiator (e.g., peroxide). The formulations may include a chelating agent solution to improve storage stability and other properties. Further, the mole ratio of the initiator to the reducing agent may be adjusted to control weight loss of the adhesives during cure. Polyvinyl acetate or its derivatives may also be employed in the adhesive formulations to reduce weight loss during cure. Moreover, certain embodiments of the formulations include a toughening-agent copolymer having a glass transition temperature (of at least one domain) that is lower than −50° C. (−58° F.). These toughening-agent copolymers may be added to the adhesive formulations to improve impact strength and other properties of the cured adhesives at lower temperatures, e.g., −40° C. (−40° F.), while maintaining performance of the cured adhesives at higher temperatures, e.g., 82° C. (180° F.).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.