Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles
US7777335B2 · kind B2 · utility
5Cited by
30References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2005 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Mar 9, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.