Substrate processing apparatus and method
US7779777B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2009 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | May 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate-processing apparatus includes a sample table which mounts thereon a to-be-processed substrate, a first line which supplies a chemical solution, a second line which supplies a cleaning liquid, a three-way valve connected to the first and second lines and configured to select one of the first and second lines, a filter provided across the first line upstream of the three-way valve, and configured to eliminate a foreign material from the chemical solution, and a nozzle provided downstream of the three-way valve and configured to discharge the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve. The three-way valve selects the first line when the substrate is coated with the chemical solution, and selects the second line in other cases.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.